Low temperature activation and highly effective organic thixotrope for solvent-borne and high solids Systems
Organic thixotrope for use with adhesives and sealants at very low activation temperatures. Can be used with a broad range of solvents.
· Provides viscosity control, thixotropy and excellent very thick layer sag resistance. · Is seed-resistant and allows low temperature activation, – processing, and packaging. · Is a cost effective 100 % active powder that is highly active at already low loading levels · Has a broad compatibility to various solvents. · Shows no intercoat adhesion problems when overcoated with a topcoat.
Contact us for any request for collaboration or for any misunderstanding you have!